Fujian Huixin Laser Technology Co., Ltd. (AIPhotonix Technology Co., Ltd.) is located in the Hui'an Economic Development Zone of Quanzhou, Fujian Province. Its dedicated industrial park covers an area of 93.5 mu, with a building area exceeding 50,000 square meters, focusing on the independent development, production, and sales of high-speed optoelectronic chips for AI supercomputing 400G/800G/1.6T optical modules. The company's core technology team has comprehensive mastery of key technologies, including wafer manufacturing, chip design, epitaxial growth, chip processing, packaging, and testing, and has established two full-thread independent R&D and manufacturing platforms based on Gallium Arsenide (GaAs) and Indium Phosphide (InP). The company's core product strategy is the "Double Hundred" CW DFB — mass production: 112G VCSEL chips, 112G EML chips, high-power CW DFB chips, and high-speed PD chips required for silicon photonic modules; as well as the next-generation core products: 224G EML chips and 200G VCSEL chips. The company's products also cover various types of LiDAR and sensing chips, as well as epitaxial wafers. The company will continue to expand its applications in fields such as AI supercomputing centers/data centers, AI bionic robots, autonomous driving, low-altitude economy, and wearable smart products. As a leader in high-end optoelectronic chips, it aims to provide comprehensive high-end core optoelectronic chips to support the development of the global optoelectronics industry.



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